Thanks Gary for the feedback on my features combination question. However, I design chips for consumer electronics market (cellphone). You never know how your customers will use your chip. We do randomization on all features combination, but we can only cover so many cases. It is very time-consuming and there is no guarantee. I am wondering if you have ever come across such problem.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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