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David Niewolny
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Iron
Re: Embedded Design for Medical Miniaturization
David Niewolny   11/5/2012 3:29:33 PM
NO RATINGS
The couple packing technologies I discussed were Wafer Level Chip Scale Packaging (WL-CSP) and Redistributed Chip Packaging (RCP).  Wafer level CSP is a packaging technology where the pads may be etched or printed directly onto the silicon wafer resulting in a package very close to the size of the silicon die.  RCP is an interconnect buildup technology in which the package is a functional part of the die. The technology addresses the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics.  WL-CSP is the much more common technology.  RCP is a technology that significantly reduces size, but the technology is complex and it is only being offered to customers who really value its small size, such as those in the implantable market.



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