HOME  |  NEWS  |  BLOGS  |  MESSAGES  |  FEATURES  |  VIDEOS  |  WEBINARS  |  INDUSTRIES  |  FOCUS ON FUNDAMENTALS
  |  REGISTER  |  LOGIN  |  HELP
Comment
David Niewolny
User Rank
Iron
Re: Embedded Design for Medical Miniaturization
David Niewolny   11/5/2012 3:29:33 PM
NO RATINGS
The couple packing technologies I discussed were Wafer Level Chip Scale Packaging (WL-CSP) and Redistributed Chip Packaging (RCP).  Wafer level CSP is a packaging technology where the pads may be etched or printed directly onto the silicon wafer resulting in a package very close to the size of the silicon die.  RCP is an interconnect buildup technology in which the package is a functional part of the die. The technology addresses the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer dielectrics.  WL-CSP is the much more common technology.  RCP is a technology that significantly reduces size, but the technology is complex and it is only being offered to customers who really value its small size, such as those in the implantable market.



Partner Zone
Latest Analysis
For decades there have been rumors that Microsoft essentially copied DRI's CP/M operating system and sold it to IBM as MS-DOS. In just a few days, all will be revealed.
A San Francisco startup called Otto came out of stealth mode recently and released a dramatic video demonstrating its successful test of a technology for self-driving trucks.
Researchers have found a way to use graphene to cheaply and easily turn dirty water into drinking water.
A new 1-GHz vector signal transceiver promises to offer expanded test capabilities for engineers involved in applications ranging from automotive and aerospace to semiconductors and defense.
Researchers at the Masdar Institute of Science and Technology have devised a new method for designing strong, light cellular structures of re-architected metals and plastics with optimized properties.
More:Blogs|News
Quick Poll
The Continuing Education Center offers engineers an entirely new way to get the education they need to formulate next-generation solutions.
SEMESTERS: 1  |  2  |  3  |  4  |  5  |  6 |  7 | 8 | 9 | 10


Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.
Learn More   |   Login   |   Archived Classes
Twitter Feed
Design News Twitter Feed
Like Us on Facebook

Technology Marketplace

Copyright © 2016 UBM Canon, A UBM company, All rights reserved. Privacy Policy | Terms of Service