Just saying -- we have several options, generally, when doing test. You typically have a device-under-test, which can be a chip, a module, a plug-in, a card, a sub-assembly, a major assembly, a complete system. Sometimes the DUT plugs into a test bench somehow (an exerciser which only faintly resembles the end-use environment), because of a need for more switches etc to test more options than the native environment would access. Sometimes the DUT is complicated enough that a valid test environment HAS to essentially duplicate the native (end-use) environment, in which case the "testing" tends to include presenting the widest possible range of valid external inputs to confirm receipt and handling...
Wow -- not a simple subject -- I'll be interested to see how you break this down into functional concepts to tackle it in bite-sized pieces.
Just a note: click-and-drag and CTRL-C to save what you type if you get longwinded, because the system DOES sometimes glitch-and-barf and discard your stuff. If so, click and CTRL-V to paste that "thank gods I saved a backup copy" chunk of text, and try again.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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