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Steven
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Re: Part III: MEMS in Consumer Electronics I - Taxonomy of Motion Sensors
Steven   4/25/2012 2:37:32 PM
NO RATINGS
For the majority of the MEMS devices shown in your presentation, is a Si 'cap' bonded to the peripheral face of the MEMS chip thereby creating the hermetic package which is subsequently wirebonded to a leadframe and over-molded - or is there another cheaper way to create the cavity in the molded package interior.

If not using a 'cap', is it really 'hermetic' and what might be the use environment limitations?



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