Jack, my impression of code testing is that it allows the code to be verified correct before the system is tested in the real world, where another whole set of "bugs" come to light, such as timing, impedance problems, differences between vendor spec sheets and actual chip operation, power supply stability, heat problems, RFI susceptibility and FCC compliance, etc. Is this a fair statement?
I believe in integration testing - which is the real-world stuff you mention - from day 1. There just isn't much to integrate at first, but as time goes on we've generally done a good job stressing the system.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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