Q: @Jon: Do you follow a specific sequence when debugging a MCU design _not_ made by yourself?
A: I check power first. Many times the power supply is the weakest part of a design--a cheaply built import. Then check the power to the circuit. If those are OK, what does the problem seem to be? I look for external problems such as damaged connectors, burned or extra-hot components, solder bits between contacts, nicks in narrow PCB traces, loose screw shorting contacts--generally the obvious visual things. Then I want to look at operation of external circuits such as serial port, parallel port, USB signals, etc. to get an idea of what works and what doesn't. Only then do I look at the code. That assumes I have the code to work with!
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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