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Design Hardware & Software
Cooling Strategies for Real-Time Embedded Systems
9/4/2013

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Figure 2. A wrap-around heat-sink assembly pulls heat from components on the underside of the XMC module, which would otherwise be trapped by the PCIe adapter card.
Figure 2. A wrap-around heat-sink assembly pulls heat from components on the underside of the XMC module, which would otherwise be trapped by the PCIe adapter card.

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Rob Spiegel
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Blogger
Cooling is still evaporative
Rob Spiegel   9/10/2013 12:33:00 PM
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It's interesting that after all of the innovation and advances in technology, especially electronics, the cooling is still a very basic setup of a fan blowing across hot metal.

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