What are the applications for a 4 X 4 mm ASIC package that incorporates a three-axis accelerometer wire bonded to a three-axis gyroscope? Why would anyone need that kind of size combined with that kind of capability?
Readers of this story will also be interested in our upcoming conference, which has a MEMS track.
Looking to enhance your next generation systems through the use of sensors? Look no further than the Sensors in Design conference produced by Design News and EE Times. The conference will take place March 28-29, 2012 in San Jose. Visit www.SensorsInDesign2012.com to learn more.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
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