What are the applications for a 4 X 4 mm ASIC package that incorporates a three-axis accelerometer wire bonded to a three-axis gyroscope? Why would anyone need that kind of size combined with that kind of capability?
Readers of this story will also be interested in our upcoming conference, which has a MEMS track.
Looking to enhance your next generation systems through the use of sensors? Look no further than the Sensors in Design conference produced by Design News and EE Times. The conference will take place March 28-29, 2012 in San Jose. Visit www.SensorsInDesign2012.com to learn more.
Siemens and Fraunhofer Institute for Laser Technology have achieved a faster production process based on selective laser melting for speeding up the prototyping of big, complex metal parts in gas turbine engines.
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