In a followup to the iPhone 4S teardown from our friends at UBM TechInsights, we bring you an interactive, clickable video spotlighting the smartphone's innards. The flash movie allows you to drill down to the component level and visualize the assembly and packaging of Apple's latest product.
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To order the complete UBM TechInsights teardown report on the 4S, click here and fill in the form on the page's upper right.
NPR recently did an article about phones. The actual article was not very significant, but the host's (Robert Siegel, I think) lead-in comment was. He said the phone he was discussing had all the features you'd come to expect: a large touch screen, mult-megapixel camera, GPS. There was nothing about it being a good phone!
From the design engineering standpoint, I think many people underestimate the packaging and assembly challenges inherent in such a tightly constrained design. This certainly applies to the Android phones and Blackberrys as well (though with the latter, not as much as here and with Android). Add to this the requirement for robustness, and you have a tough set of engineering requirements across the board.
I couldn't agree more, Rob. It also continues to amaze me, even at the end of 2011, that so much intuitive, cool technology fits into something so small and thin. I can't wait to see what features are showcased on the iPhone 5!
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
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