Picor Corp.'s Cool-Switch PI2161 and PI2061 is a new electronic circuit
breaker, load disconnect switch solution that address a broad range of
redundant intermediate bus requirements. Targeted for medium to high voltage,
high-side redundant bus applications, the Cool-Switch PI2161 is a complete
high-density, full-function electronic load disconnect solution with an
integrated high-speed controller driving a MOSFET possessing a low on-state
resistance of less than 9 milli-Ohms. The PI2161 is 60V rated and features
an integrated charge pump for narrow-range, high-side 48V bus applications.
This thermally enhanced 7 x 8 mm land grid array System-in-Package (SiP)
solution is capable of delivering up to 12A over a wide range of operating
temperatures. The internal MOSFET provides high efficiency and low loss
current sensing feature that eliminates the need for sensing total load current
resulting in the ability to use low power sense resistors.
The Cool-Switch PI2061 solution is a
universal high-speed, high-side load disconnect controller IC for use with
N-channel MOSFETs. Optimized for 12 and 48V systems, the controller IC
also can be used in wide-range systems required to operate during input voltage
transients up to 100V for 100 ms. An internal charge pump eliminates the need
for a separate bias supply for high side applications. The PI2061 controls
either a single MOSFET or paralleled MOSFETs to facilitate operation and protection
at higher current levels. The 3 mm square controller is a low power loss
solution with fast dynamic response to fault current conditions. Both solutions
provide an active low fault flag output for system diagnostics indicating an
over-current trip or UVLO fault conditions.
For 3D printing to make the jump from rapid prototyping to manufacturing, engineers will need to find easier ways to move products from their CAD screens to their printers.
Gigabit and PoE are two networking technologies moving ahead in tandem as industrial users power remote Ethernet devices such as IP security cameras at 1,000 Mbps over existing CAT5 cable.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
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