Henkel Corp.'s Terostat MS 500 is a high strength
hot melt adhesive with high initial tack for immediate handling. Terostat MS
500 is based on modified silane polymers and provides high initial bond
strength immediately after assembly, making the adhesive suited for fully automated
framing of crystalline modules. Terostat MS 500 is easy to handle
when compared to conventional adhesive tapes that require additional processing
steps like changing reels and disposing of release paper. The hot melt adhesive
provides primerless adhesion to glass, metal and plastics, and long-term
resistance to challenging weather conditions.
Terostat MS 500 is highly flexible
over a range of temperatures from -20 to 100C. UV and damp heat resistant,
this adhesive compensates for differing rates of thermal expansion between
I would hope this would contribute to the lowering of the costs of producing PV modules. Getting the cost of these modules downa dn improving the efficiencies, both electrically and for manufacturing is a good place to be for this product.
I would also think that long term stability in the field would be a good characteristic to elaborate on. I am not sure of what loads other than thermal the PV modules experience in the field but it would definitely be helpful to be able to point to the manufacturers long term studies of the adhesive performance in field conditions.
In many engineering workplaces, there’s a generational conflict between recent engineering graduates and older, more experienced engineers. However, a recent study published in the psychology journal Cognition suggests that both may have something to learn from another group: 4 year olds.
Conventional wisdom holds that MIT, Cal Tech, and Stanford are three of the country’s best undergraduate engineering schools. Unfortunately, when conventional wisdom visits the topic of best engineering schools, it too often leaves out some of the most distinguished programs that don’t happen to offer PhD-level degrees.
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