Solvay Advanced Polymers LLC's
KetaSpire KT-851 NT is a medium-viscosity resin designed for use in melt
extrusion-based wire and cable insulation layers and for the production of
monofilaments and high denier multi-filament fibers. Cleanliness is achieved
through Solvay's proprietary filtration process and allows for production of
articles that are low in gel content and other particulate contamination.
The new PEEK grade
exhibits long-term oxidative thermal stability for use in high-temperature
environments over prolonged durations. KT-851 NT can be used for melt extrusion
of thin films down to thicknesses as low as six microns, supporting
applications such as capacitors, speaker membranes and aerospace
thermal-acoustic insulation blankets and bagging materials. Other demanding
uses are in the medical industry for components like thin-walled medical
capillaries and tubing. KT-851 is available in two versions: KT-851 NT
incorporates a trace level (0.01 percent) of a lubricant dusted on the pellets
to facilitate conveying in extrusion screws while KT-851 NL is the pure polymer
with no lubricant.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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