Master Bond's Polymer System EP37-3FLF is an optically clear, two
component epoxy with resistance to cryogenic temperatures and severe thermal
cycling. Its low exotherm also makes it useful for potting, encapsulating and
casting systems, especially where wider cross section thicknesses are
specified. Its combination of properties allows it to cure without stressing
Serviceable over the range of 4K to 250F,
EP37-3FLF cures at room temperature in 2 to 3 days or faster at elevated
temperatures. This epoxy offers a non-critical 1 to 1 mix ratio by weight or
volume, and a low mixed viscosity of 1,400 to 1,500 cps. Users can work with a
100 g mass of the adhesive at room temperature for up to 90 mins.
EP37-3FLF has a bond shear strength exceeding
2,000 psi and a T-peel strength of 25 pli. This flexible epoxy has an elongation
of 180 percent and electrical insulation properties with a volume resistivity
of 1x1014 ohm-cm. It bonds to a variety of substrates including metals, glass,
ceramics, rubbers and many plastics and is widely used in the optical,
electrical, electronic, computer and OEM industries.
EP37-3FLF is sold in pint, quart, gallon and 5
gallon container kits and has a 6 month shelf life if unopened and stored at
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.