Master Bond's Polymer System EP37-3FLF is an optically clear, two
component epoxy with resistance to cryogenic temperatures and severe thermal
cycling. Its low exotherm also makes it useful for potting, encapsulating and
casting systems, especially where wider cross section thicknesses are
specified. Its combination of properties allows it to cure without stressing
Serviceable over the range of 4K to 250F,
EP37-3FLF cures at room temperature in 2 to 3 days or faster at elevated
temperatures. This epoxy offers a non-critical 1 to 1 mix ratio by weight or
volume, and a low mixed viscosity of 1,400 to 1,500 cps. Users can work with a
100 g mass of the adhesive at room temperature for up to 90 mins.
EP37-3FLF has a bond shear strength exceeding
2,000 psi and a T-peel strength of 25 pli. This flexible epoxy has an elongation
of 180 percent and electrical insulation properties with a volume resistivity
of 1x1014 ohm-cm. It bonds to a variety of substrates including metals, glass,
ceramics, rubbers and many plastics and is widely used in the optical,
electrical, electronic, computer and OEM industries.
EP37-3FLF is sold in pint, quart, gallon and 5
gallon container kits and has a 6 month shelf life if unopened and stored at
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
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