RF Micro Devices Inc.'s RF724x power amplifiers
support ultra-high peak efficiency of 48-51 percent and is comprised of five
PAs covering WCDMA bands 1, 2, 4, 5 and 8, addressing common 3G/4G frequency
bands and band combinations. All RF724x power amplifiers are packaged in a 3x3
mm footprint, improving smartphone platform flexibility and ease of
implementation. RFMD's RF724x power amplifiers also feature an integrated high
directivity coupler, standard 2-bit GPIO control logic and low insertion phase
shift between bias states.
When combined with one of
RFMD's companion dc-dc converters or with chipsets featuring on-chip dc-dc
converter functionality, RFMD's RF724x power amplifiers can deliver DG.09
performance as low as 13 mA - directly translating into 3G talk time.
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
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