Elma Bustronic Corp.'s CompactPCI PlusIO
Backplane is compliant to the latest PICMG 2.30 specifications. The first
in the series is an 8-slot version in a 3U height. PICMG 2.30 expands the
backplane with serial point-to-point connections for high-speed data transfer
(PCIe, SATA, USB, Ethernet). The Elma Bustronic 8-slot version offers 1
CompactPCI PlusIO system slot, 4 CompactPCI PlusIO peripheral slots and 3
legacy slots. The system slot has connections for 4 x USB2, 4 x SATA, 4 x PCIe
and 2 x ETH.
The CompactPCI PlusIO Backplane
comes in a 3U height with a 12-layer stripline design. Standard FR-4 PCB
material was used on the 8-slot backplane and rear IO is supported. The lead-time is
2-4 weeks ARO.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.