JST Corp.'s ZPD Series wire-to-board,
double row, crimp style connectors are designed with a secure locking device to
ensure connector mating integrity even under adverse conditions. These SMT and
through-hole connectors are polarized and have a positive locking feature that
provides an audible click with tactile feedback when mated. These 1.5 mm (059
inch) pitch, top and side entry connectors are useful for consumer, commercial,
medical and industrial high density, low current, low voltage applications.
disconnectable, crimp style ZPD Series is available in 10 to 30 circuits in
increments of 2 circuits and is rated at 2.0 A ac/dc (using 24 AWG) at 100V
ac/dc. These low profile connectors have a mated side-entry height of 9.2 mm (.362
inch) and a top entry mated height of 9.5 mm (.374 inch). Wire sizes AWG #28 to
#24 are accommodated. Temperature range is - 25 to +85C (including temperature
rise in applying electrical current). The crimp contact housings are molded of
a UL94V-0 rated PBT material. Contacts are copper alloy, copper undercoated and
tin plated. The RoHS compliant SMT headers are molded of a Polyamide UL94V-0 rated
material. The top entry headers also feature weld tabs to provide additional
retention to the pcb.
are offered on standard size reels for semi-automatic or fully automatic application
tooling while mini-reels are offered for mini-reel hand tools. SMT headers are
provided on embossed tape for automatic insertion equipment.
Researchers at the University of Maryland have achieved a first in lithium-ion battery science: the development of a successful lithium-based battery using one material for all three core components of a battery -- anode, cathode, and electrolyte.
The online Bar Steel Fatigue Database for automotive design engineers has been updated for the fifth time and now contains 134 iterations, or grade/process combinations. It provides better predictability for designing parts with long-term reliability and durability.
FPGAs use programmable fabric to create custom logic, but this flexibility comes at a cost -- usually around 10 times more silicon real estate and 10 times the power dissipation. Can we really claim any FPGA is low power?
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