Festo's CoDeSys embedded controller is for use with its CPX
series of multifunctional control terminals. CoDeSys is an IEC 61131-3 compatible programming environment. The controller benefits current users of IEC
61131-3, since they can port over their existing code, libraries, function
blocks, reducing programming time. There
are six programming languages provided by CoDeSys. The new CPX-CEC module
provides machine builders with a way to oversee all the units in a CPX terminal
- regardless of whether they are for pneumatic or electric drives or I/O
functions. Suitable for single and multi-axis applications, the CPX-CEC can
operate autonomously or in conjunction with a host controller, such as a master
PLC, and it can also be used as an intelligent slave in fieldbus-based systems
to provide localized signal pre-processing.
The CPX-CEC embedded controller is
essentially a PLC, but with additional functionality. Based on a 400 MHz low
power consumption 32-bit processor, backed by 64 MB of memory, it features an
Ethernet 10/100 Base-T interface for programming and host controller communications
and uses a backplane bus system to communicate with other modules in the CPX
terminal. The controller has a cycle time of just 1 ms - making it one of the
fastest on the market - and can be supplied configured as a fieldbus slave or
as a CAN master for controlling other CANopen devices, such as electric drives.
It supports all popular fieldbus protocols, including PROFIBUS, PROFINET,
Ethernet/IP, DeviceNet, Modbus TCP, CANopen, CC-Link and EtherCAT.
CPX-CEC is an embedded solution - all component parts are enclosed within the
module, which carries an IP65/67 rating against dust and water ingress. The
ability to deploy the CPX terminal and its constituent modules in the same
environment as the machine itself - even on the machine if required - provides
system designers with a flexible solution for decentralized control.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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