In recognition of the link between smaller and faster
electronics and more pronounced heat dissipation, Mentor Graphics has transformed FloTHERM
from a simple observation platform into a thermal design problem-solving tool
that can help engineers more readily resolve heat flow design challenges.
Mentor leverages patent-pending mathematical technologies in
the next-generation FloTHERM release to provide Bottleneck (Bn) and Shortcut
(Sc) fields, allowing engineers for the first time to identify not only where
heat flow congestion occurs in their electronics design, but also identifies
thermal shortcuts to quickly and efficiently resolve the problem. "The
applications that FloTHERM can be brought to bear on haven't changed - rather
how FloTHERM helps a thermal design engineer understand ‘why' the design is
running too hot and aids in the recommendation of ‘how' to rectify the design
to ensure thermal compliance has radically changed in this latest release,"
says Robin Bornoff, Ph.D., FloTHERM product manager.
Using these two new technologies in conjunction with
FloTHERM's classic thermal analysis capabilities will help designers arrive at
a better resolution in a shorter period of time. "The Bn and Sc fields can be
visualized in the 3-D model to pinpoint directly the underlying reasons why and
where the design is running too hot and where to best remedy the design,"
Bornoff explains. "Such an approach ... helps engineers become more experienced
more quickly and allows them to respond much more quickly to changes in the
design concurrently throughout the design process."
For 3D printing to make the jump from rapid prototyping to manufacturing, engineers will need to find easier ways to move products from their CAD screens to their printers.
Gigabit and PoE are two networking technologies moving ahead in tandem as industrial users power remote Ethernet devices such as IP security cameras at 1,000 Mbps over existing CAT5 cable.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
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