Master Bond's EP21TDCS-LO
is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA
low outgassing specifications. The adhesive cures at room temperature in 24-48
hours and in 1-2 hrs at 200F. It features a tensile shear strength of more than
1,800 psi, a T-peel of greater than 5 pli and adhesion to similar and
dissimilar substrates. The volume resistivity of the system is less than 10-3
ohm-cm. Serviceable over the range of 4K to 275F, EP21TDCS-LO is suitable for
cryogenic applications. It withstands thermal cycling and is resistant to
chemicals, including water, oil and most organic solvents.
The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its
low drip formula, EP21TDCS-LO can be conveniently applied with a syringe,
knife, spatula or trowel to vertical surfaces without sagging and only contact
pressure is required for curing. Syringes have a 3 month shelf life and glass
jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is
available in premixed and frozen syringes, as well as in metal containers. It
is widely used for applications in the electronic, electrical, computer,
semiconductor, aerospace and optical industries.
The series now can interface with a wider array of EtherNet/IP-compliant hardware across many industrial sectors, including factory automation systems, plastic injection molding apparatus, and materials-handling equipment.
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