Master Bond's EP21TDCS-LO
is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA
low outgassing specifications. The adhesive cures at room temperature in 24-48
hours and in 1-2 hrs at 200F. It features a tensile shear strength of more than
1,800 psi, a T-peel of greater than 5 pli and adhesion to similar and
dissimilar substrates. The volume resistivity of the system is less than 10-3
ohm-cm. Serviceable over the range of 4K to 275F, EP21TDCS-LO is suitable for
cryogenic applications. It withstands thermal cycling and is resistant to
chemicals, including water, oil and most organic solvents.
The epoxy offers a simple 1 to 1 mixing ratio by weight or volume. With its
low drip formula, EP21TDCS-LO can be conveniently applied with a syringe,
knife, spatula or trowel to vertical surfaces without sagging and only contact
pressure is required for curing. Syringes have a 3 month shelf life and glass
jars have a 6 month shelf life, if stored at room temperature. EP21TDCS-LO is
available in premixed and frozen syringes, as well as in metal containers. It
is widely used for applications in the electronic, electrical, computer,
semiconductor, aerospace and optical industries.
In a move that strengthens its 3D design business, Stratasys continued a 15-month buying spree this week by announcing its plan to acquire GrabCAD, a provider of a cloud-based collaboration environment for engineers.
Many diverse markets take advantage of semiconductor IP; so many that no one can recite the entire list without leaving off several. So why do we track all the vertical markets? They all have a unique set of requirements and value attributes differently. One major vertical market segment is automotive.
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