Thermal Solutions' OptoCooler HV37 module is designed to
address photonics cooling applications with larger heat pumping requirements.
At 85C, the OptoCooler HV37 can pump 4.5W or 107W/cm2 of heat in footprint of 6
mm2, is 0.6mm high and can create a temperature differential (deltaT) of up to
60C between its hot and cold sides. It operates at a maximum voltage of 7.7V,
making it compatible with commonly found board-level currents and voltages. At
25C, the device can create a deltaT of up to 50C with a maximum voltage of
OptoCooler HV37 is RoHS-compliant and is manufactured using gold-tin (AuSn)
solder, which enables assembly temperatures as high as 320C.† These assembly temperatures make the HV37
module compatible with processes for packaging photonics devices that require
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Design engineers need to prepare for a future in which their electronic products will use not just one or two, but possibly many user interfaces that involve touch, vision, gestures, and even eye movements.
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