Thermal Solutions' OptoCooler HV37 module is designed to
address photonics cooling applications with larger heat pumping requirements.
At 85C, the OptoCooler HV37 can pump 4.5W or 107W/cm2 of heat in footprint of 6
mm2, is 0.6mm high and can create a temperature differential (deltaT) of up to
60C between its hot and cold sides. It operates at a maximum voltage of 7.7V,
making it compatible with commonly found board-level currents and voltages. At
25C, the device can create a deltaT of up to 50C with a maximum voltage of
OptoCooler HV37 is RoHS-compliant and is manufactured using gold-tin (AuSn)
solder, which enables assembly temperatures as high as 320C. These assembly temperatures make the HV37
module compatible with processes for packaging photonics devices that require
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
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