Nextreme
Thermal Solutions' OptoCooler HV37 module is designed to
address photonics cooling applications with larger heat pumping requirements.
At 85C, the OptoCooler HV37 can pump 4.5W or 107W/cm2 of heat in footprint of 6
mm2, is 0.6mm high and can create a temperature differential (deltaT) of up to
60C between its hot and cold sides. It operates at a maximum voltage of 7.7V,
making it compatible with commonly found board-level currents and voltages. At
25C, the device can create a deltaT of up to 50C with a maximum voltage of
5.9V.
The
OptoCooler HV37 is RoHS-compliant and is manufactured using gold-tin (AuSn)
solder, which enables assembly temperatures as high as 320C. These assembly temperatures make the HV37
module compatible with processes for packaging photonics devices that require
tight tolerances.
Almost every automaker has had to 'pick a side' when it comes to alternative fuel options and ways to divest from a reliance on gasoline. Fiat is looking to back compressed natural gas or liquid propane as an interim solution.
Designing and filling a new type of water bottle might take less engineering work, but the description will help kids understand how science, math, and engineering influence their lives even through things that seem mundane.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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