Bond Inc.'s EP62-1MED is a two component epoxy adhesive system for chemical
and temperature resistance. This compound is specifically designed to withstand
repeated cycles of steam, ethylene oxide, radiation and chemical sterilization.
EP62-1MED cures at moderately elevated temperatures (150 - 200F) and offers a
long working life at room temperatures. It contains no solvents or volatiles
and has a 100 to 10 mix ratio by weight.
EP62-1MED bonds to metals,
glass, ceramics, wood and most plastics and is serviceable up to 400F. Shrinkage upon cure is <0.06 percent. The color of part A is clear and part B is
brown. EP62-1MED is available in pint,
quart, gallon and 5 gallon kits. It is
also available in gun applicators for ease of use.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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