VIA Technologies Inc.'s VIA EPIA-P830 Pico-ITX board is for advanced portable and network connected
embedded applications. It features the VIA Nano E-Series processor and the latest
VIA VX900 media system processor with additional support for dual Mini-PCIe
modules, bringing 3G and wireless connectivity options.
The VIA EPIA-P830 extends the Pico-ITX by using low profile expansion boards to
provide on-board access to VGA, RJ45 and two USB ports plus dual Mini-PCie
slots for a range of Mini-PCIe modules.
The latest microprocessor platform from
VIA is tailor-made for embedded applications that comprises the mature and
optimized VIA Nano E-Series processor and the latest VIA VX900 media system
processor. VIA embedded processor platforms have extended longevity support of
up to seven years.
The VIA Nano E-Series processor
delivers out-of-order 64-bit processing that keeps in step with the need for
raw performance while remaining within rigidly low energy, low heat parameters.
The latest VIA VX900 MSP adds support for DDR3 memory, HD audio support,
advanced display connectivity and a high performance hardware HD video decoder
with the latest VIA ChromotionHD 2.0 video engine.
The VIA ChromotionHD 2.0's filtering
and post-processing performs decoding of MPEG-4/AVC, H.264, MPEG-2, VC-1 and
WMV-HD for smooth playback of multimedia titles at resolutions up to 1080p
without incurring a heavy CPU load.
Measuring 10 x 7.2 cm the ultra compact
features a 1.2GHz VIA Nano E-Series processor and supports up to 4 Gbyte of
DDR3 800/1066 SODIMM system memory. The VIA VX900 Media System Processor
provides hardware acceleration for the latest HD video codecs at display
resolutions of up to 1080p. The VIA Chrome9 HCM 3D integrated graphics core has
full DirectX 9.0 support and a 128-bit 2D engine with hardware rotation
The VIA EPIA-P830 uses a specially
designed I/O add-on-board which supplements the native HDMI port to add a VGA
port, a Gigabit LAN and two USB 2.0 ports. The VIA Vinyl HD audio codec
provides 6 channel, DTS capable audio with S/PDIF support. Storage is provided
via two SATA ports. On board pin headers provide support for 1 channel LVDS
display support, an additional 5 x USB 2.0 ports, an LPC connector, SMBus
connector, PS/2 support, audio jacks, LVDS, 4 pairs of DIO and two UART ports.
A dc-in power connector is also provided.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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