Master Bond's EP21ANHT is
a highly thermally
conductive epoxy system that is specially designed to help mitigate the
issues associated with tightly packed components and miniaturized electronic
circuits. With a thermal conductivity over 22 BTU/in/ft²/hr/F and
serviceability from -60 to 400F, Master Bond EP21ANHT can be used in
microelectronic applications. The cured adhesive is also an electrical
This two component adhesive, sealant and coating has a 1 to 1 mix ratio by
weight or volume and offers room temperature and faster elevated temperature
cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/C,
a dielectric strength of >400V/mil and a tensile shear strength greater than
1,000 psi. It resists a wide range of chemicals and adheres well to a variety of
EP21ANHT is available in pint, quart, gallon and 5 gallon kits.
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.