Master Bond's EP21ANHT is
a highly thermally
conductive epoxy system that is specially designed to help mitigate the
issues associated with tightly packed components and miniaturized electronic
circuits. With a thermal conductivity over 22 BTU/in/ftÂ²/hr/F and
serviceability from -60 to 400F, Master Bond EP21ANHT can be used in
microelectronic applications. The cured adhesive is also an electrical
This two component adhesive, sealant and coating has a 1 to 1 mix ratio by
weight or volume and offers room temperature and faster elevated temperature
cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/C,
a dielectric strength of >400V/mil and a tensile shear strength greater than
1,000 psi. It resists a wide range of chemicals and adheres well to a variety of
EP21ANHT is available in pint, quart, gallon and 5 gallon kits.
Days after a massive, distributed denial-of-service attack took down dozens of major websites around the country, ARM Holdings plc is rolling out a pair of new processor architectures aimed at shoring up IoT security.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.