Yuden's latest lines of chip filters
optimize the performance, while minimizing the size, of mobile phones. The
compact EIA 0603 size multilayer dual low pass filter is designed for use with
multi-band smartphones, while two new optimized EIA 0805 size multilayer
diplexers were developed for use with mobile phones. Taiyo Yuden chip filters
for the cellular band field are based on experience with and development of
multilayer filters and chip antennas for non-cellular band applications, such
as wireless LAN, Bluetooth and GPS.
The EIA 0603 size dual low pass filter F1168D087018 measures 1.6 x 0.8 mm with
a maximum height of 0.45 mm and two differing frequency band low pass filters
(the GSM telecommunication standard low band and a high band) are combined into
a single part. This reduction in parts and surface mount area contribute to a
smaller overall device size. Smartphones equipped with dual low pass filter
technology meet the wireless communication standards that are required to
achieve high-speed data transmission.
The EIA 0805 size F1212P089208 and F1212P089213 (2.0 x 1.25 x 0.90 mm each)
multilayer diplexers are optimized for the RF send/receive systems of
multi-band mobile phones. To meet the growing demand for multiple frequency
band support, a multi-antenna method is often utilized. Two antennas for
different frequency bands are used for sending and receiving RF signals, with a
diplexer that performs the required multiplexing and de-multiplexing
operations. This often results in a higher component count and increased
mounting space requirements.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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