Beckhoff Automation's CU8890 WLAN adapter was
developed to provide cost-effective wireless solutions to machine builders and
manufacturers in North America. With the recently FCC certified CU8890,
Beckhoff has expanded its range of Industrial PC accessories with a WLAN module
that is suitable for industrial use.
The USB-to-WLAN adapter permits wireless
integration of Industrial PCs into an Ethernet network. With regard to its
electromagnetic compatibility, the DIN rail mounted WLAN box complies with
rigorous industrial standards making it well-suited for use in harsh
manufacturing environments.
The FCC certified
Beckhoff CU8890 supports the WLAN standard IEEE 802.11 b/g. An
integrated DIN rail adapter allows convenient installation in control cabinets.
When connected to an Industrial PC with USB port, the controller facilitates
the fieldbus-neutral exchange of all UDP/TCP-based data and can be used both as
an access point and as a client. Client drivers are available for Windows XP,
Embedded Standard and Windows CE and, therefore, for all Beckhoff Industrial PC
and Embedded PC series. Software drivers for Windows XP and Embedded Standard
make it possible for the CU8890 to also be operated as an access point.
The CU8890
features a reverse SMA plug, to which various radio antennas to suit the
respective environment can be attached. Beckhoff offers a complete range of
antennas and cables for the most diverse applications and conditions. Depending
on ambient conditions, the free-field distance between two CU8890 modules may be
up to 984 ft (300 m). The user can choose between 11 channels in the
2.4 GHz band, to adhere to country-specific regulations where necessary.
For 3D printing to make the jump from rapid prototyping to manufacturing, engineers will need to find easier ways to move products from their CAD screens to their printers.
Gigabit and PoE are two networking technologies moving ahead in tandem as industrial users power remote Ethernet devices such as IP security cameras at 1,000 Mbps over existing CAT5 cable.
New versions of BASF's Ecovio line are both compostable and designed for either injection molding or thermoforming. These combinations are becoming more common for the single-use bioplastics used in food service and food packaging applications, but are still not widely available.
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