MEN Micro Inc.'s DC2 is a rugged panel display that combines
capacitive touch technology for human interface with a fanless,
DC2 is equipped with an Intel Atom
1.3 GHz XL Z520PT processor, 1 Gbyte of DDR2 SDRAM and a 2 Gbyte microSD card
and offers high data throughput and memory capacities. DC2 can also accommodate
additional Intel processor configurations.
is useful in transportation, mobile and industrial automation applications, the
panel-mounted DC2 features a 10.4 inch 4:3 LCD TFT display with a 1024 x 768
resolution as standard, with larger screen sizes up to 19 inches as well as
higher resolutions and aspect ratios available. Specific applications include
train driver cabins, buses and agricultural machines as well as information panels within a vehicle or at a
Standard I/O is comprised of two
Fast Ethernet and two USB ports as well as four binary inputs via the 10-pin
power supply connector. The Ethernet interfaces have switch functionality to
provide Ethernet connection to subsequent intelligent displays. A temperature
sensor monitors and controls the display.
The unit's control electronics,
attached directly to the back of the display, allow for the customized screen
sizes, alternative processors and various aspect ratios. The DC2
enables more configuration options including the use of M12 connectors as well
as connecting additional interfaces, a GPS adapter or HD audio. A MiniPCI
Express card slot with an external antenna can be used for wireless functions,
such as WLAN, WIFI, GSM/GPRS, EDGE, UMTS, HDSPA and LTE.
The DC2 is equipped with a 9 to 36V
wide-range power supply and operates from -40 to +70C as well as at +85C for up
to 10 minutes according to temperature class Tx. All components are soldered to
withstand shock and vibration and are prepared for conformal coating. The panel
computer is prepared for the e1 automotive certification and also corresponds
to railway standard EN50155 with an additional power supply unit.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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