Nextreme Thermal Solutions' eTEG HV37 thermoelectric power generator converts
waste heat into electrical energy for a variety of self-powered applications in
the wireless sensor, automotive, aerospace, industrial and medical device
HV37 is capable of producing 1.0 mW of output power and an open circuit voltage
of 170 mV at a 10K-T in a footprint of 6 mm2.
At 50K -T, the HV37 produces 24 mW of power and an open circuit voltage
is 0.6mm high and can be configured electrically in series to produce higher
voltage and power outputs.
Nextreme's eTEG devices generate electricity via the
Seebeck Effect where a voltage is produced from the temperature differential
produced by heat flow through the device.
voltage output of the HV37 is enabled by Nextreme's proprietary micro-scale
thermoelectric technology. Certain applications (e.g., generating power off the
heat of the human body, or generating power for wireless sensors) require a
high density of thermoelectric elements in order to generate power at low
temperature differentials. Nextreme's patented thermal bump fabrication process
can achieve thousands of elements per square centimeter.
HV37 is a replacement module for the eTEG UPF40, Nextreme's first thin-film power generator.
The HV37 has similar power characteristics to the UPF40, but with much higher
output voltage in a smaller footprint. The new module is RoHS-compliant and
manufactured using eutectic gold-tin solder, which enables assembly temperatures
as high as 320C.
The fun factor continues to draw developers to Linux. This open-source system continues to succeed in the market and in the hearts and minds of developers. Design News will delve into this territory with next week's Continuing Education Class titled, “Introduction to Linux Device Drivers.”
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