SABIC Innovative Plastics' flame-retardant Extem UP
thermoplastic polyimide (TPI) resins are extreme high-heat materials that
recently achieved a UL746B relative temperature index (RTI) rating of 240C by
incorporating polyetheretherketone (PEEK) into its Extem resin. This unique
blend technology opens opportunities for lower-weight, high-temperature
continuous use applications such as semiconductor chip trays, connectors for
harsh environments and metal replacement in high-heat oil and gas and aerospace
Extem UP resins combine the best features of
semi-crystalline PEEK, including excellent chemical and wear resistance and
high flow, with the advantages of a high glass transition temperature amorphous
material, including mechanical strength/stiffness, dimension stability and
creep resistance at high temperatures. They meet UL746B requirements at an RTI
of 240C, indicating retention of certain mechanical and electrical properties
at this temperature over a period of 10 years.
SABIC says specific performance highlights are: up to
five times greater flex strength and up to five times higher stiffness than
unfilled PEEK at 200C; and dimensional stability expressed as a coefficient of
thermal expansion (CTE) is up to 30 percent lower than unfilled PEEK. These
performance properties allow customers to design parts with greater freedom and
efficiency, achieve higher strength and stiffness using thinner walls to reduce
material weight and costs, and provide tighter dimensional control for
Extem UP resins are currently available as unfilled
grades. Glass fiber-, mineral- and carbon-fiber-filled, as well as lubricated
grades are now under development. The materials are an excellent candidate for
conversion processes like injection molding and extrusion. Potential
applications include semiconductor parts (seals, pick-up systems), electrical
components (connectors, wire and cable), industrial parts (bearings, gears,
bushings) and transportation composites and connectors.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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