the Bn and the Sc fields elevate the use of simulation from an observation tool
which identifies heat management problems to an effective thermal design
problem-solving tool which suggests potential solutions to the designer.
The Bn field
shows where in a design the heat path is being congested as it attempts to flow
from high junction temperature points to ambient. Design changes to these
bottlenecks can help solve the heat flow problem. The Sc field highlights
possible solutions where the addition of a simple element to the design will
provide a new effective heat flow path to further cool the system.
additional enhancements have been made in the new FloTHERM v.9 product: XML model and
geometry data importing to enable FloTHERM integration into existing data
flows and a direct interface to the Mentor Graphics Expedition PCB design
platform. The direct interface enables users to import native Expedition PCB
data and delete or edit additional objects (heatsinks, thermal vias, board
cutouts, EM cans).
software is compatible with other Mentor products.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.