pad offers a compliant, silicone-free elastomer gap filler designed to provide
moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0
in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch
increments, this soft interface pad conforms with minimal pressure, resulting
in minimal thermal resistance even at low pressure with little or no stress on
mating parts. It also includes differential tack on one side and is dry to the
touch on the other side.
SF600 DF passes "cleanliness" testing requirements and is rated for
International Disk Drive Equipment and Manufacturing Association (IDEMA)
M11-99, M7-98, M12-99, and M13-99 standards. The gap filler pad is RoHS
compliant and is certified to UL 94V0 flammability rating.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.