Engineering Solutions (X-ES) is shipping from stock the XPand1010, a
two-slot 6U VPX (VITA 46) conduction-cooled chassis. The chassis provides
system engineers with an inexpensive 6U VPX desktop or lab bench platform to
jump-start software or hardware development when using X-ES Freescale- or
Intel-based CPU boards.
The XPand1010 allows customers to
utilize fully rugged, conduction-cooled cards in a small footprint, low-cost development
chassis. Customers can then install those same 6U VPX cards into
deployable ATR or similar chassis with no changes to the 6U modules. This
is in contrast to the traditional model of development for conduction-cooled
systems, in which early work is performed using non-rugged, air-cooled cards
that are mechanically and thermally incompatible with the final deployed
The XPand1010 hosts up to two 6U VPX
conduction-cooled cards, providing fabric interconnect between the two slots,
as well easy access to Gigabit Ethernet, SATA, USB, DVI and serial port I/O
from one or both of the installed 6U VPX SBCs. The XPand1010's design
eliminates card cages, rear transition modules and large noisy fans typically
found in air-cooled development chassis.
The complete XPand1010 development
system includes a backplane with integrated I/O connectors, conduction cooling
system, and power supply. Priced at $3,295, the XPand1010 is available
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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