As part of its vision to improve engineering productivity
and help reduce development costs, ANSYS
has released Ansoft Designer 6.0, a new version of the platform with Solver on
Demand, new technology that lets electronic design engineers analyze
signal-integrity, power-integrity and electromagnetic interference (EMI)
problems from a single schematic- and layout-based environment.
With Ansoft Designer 6.0, high-speed electronics and
RF/microwave designers can access field and circuit simulation tools while
designing electronic packages and printed circuit boards (PCBs) early in the
design cycle, as opposed to later in the process when expensive manufacturing
costs can be incurred. ANSYS' new Solver on Demand technology integrates HFSS£,
3-D electromagnetic field simulation software from ANSYS and HSPICE, the integrated
circuit simulation tool from Synopsys, within the Ansoft Designer 6.0 design
platform. The resulting benchmark design flow can be tapped to predict how
high-frequency electromagnetic components affect the integrated circuits.
While electromagnetic field simulation can be a
challenge for electrical engineers due to the requirements of 3-D modeling,
building HFSS directly into Ansoft Designer 6.0 mitigates many of those
bottlenecks, ANSYS officials say. Models of RFIC layout, IC packages and printed
circuit boards from Cadence Design Systems,
Mentor Graphics and Zuken can be imported directly to Ansoft
Designer and solved in HFSS without any further setup. The package layout can
also be parameterized to compute tuning and sensitivity to understand impedance
variations due to process.
Ansoft Designer 6.0 provides a powerful user
interface to HSPICE with direct links to HFSS and access to the ANSYS QuickEye
and VerifEye convolution and statistical eye analysis as well as IBIS-AMI
"Ever-smaller and sophisticated electronic
products integrate digital and wireless technologies, creating tough new design
challenges for RF performance, system signal integrity and EMI, low power and communications
reliability," says Lawrence Williams, director of product management,
Electronics Business Unit at ANSYS. "Partnering with Synopsys allows our joint
customers to tackle these challenges."
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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