Corp. entered the
field of photonic curing and is introducing SINTERON 2000—its new system for sintering, or
annealing, conductive nanoparticles on heat sensitive materials at low cost.
Recognized in the marketplace as the leader in pulsed light curing, Xenon was a
natural for developing this technology, and SINTERON 2000 is the proof that the
market was correct. SINTERON 2000 is able to sinter conductive inks in less
than a millisecond on a variety of low cost, heat sensitive materials such as
paper, polyethylene films and PET. And it turns in this performance at a
significantly lower price tag than other photonic curing systems.
The SINTERON 2000 system is
flexible, offering researchers the ability to adjust both the energy level and
pulse durations delivered to the flashlamp. Its speed and low substrate
heat—one flash in less than 1 millisecond at room temperatures with up to 2,000
joules—achieves excellent conductivity while also offering an unprecedented
ability to sinter copper nano inks as well as silver. Prior to photonic
technology, copper annealing had been a difficult challenge due to oxidation;
now copper, which is lower in cost than silver, can be used effectively.
The SINTERON 2000 system
features a high energy pulsed xenon lamp that provides a broadband spectrum
from 240 nm to 1000 nm. In addition, the Sinteron 2000 provides a 19-inch rack
unit that contains the power supply, controller and four pulse forming networks
(PFN). By allowing easy connections for these PFN stages, different pulse
durations can be quickly configured.
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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