Corp. entered the
field of photonic curing and is introducing SINTERON 2000—its new system for sintering, or
annealing, conductive nanoparticles on heat sensitive materials at low cost.
Recognized in the marketplace as the leader in pulsed light curing, Xenon was a
natural for developing this technology, and SINTERON 2000 is the proof that the
market was correct. SINTERON 2000 is able to sinter conductive inks in less
than a millisecond on a variety of low cost, heat sensitive materials such as
paper, polyethylene films and PET. And it turns in this performance at a
significantly lower price tag than other photonic curing systems.
The SINTERON 2000 system is
flexible, offering researchers the ability to adjust both the energy level and
pulse durations delivered to the flashlamp. Its speed and low substrate
heat—one flash in less than 1 millisecond at room temperatures with up to 2,000
joules—achieves excellent conductivity while also offering an unprecedented
ability to sinter copper nano inks as well as silver. Prior to photonic
technology, copper annealing had been a difficult challenge due to oxidation;
now copper, which is lower in cost than silver, can be used effectively.
The SINTERON 2000 system
features a high energy pulsed xenon lamp that provides a broadband spectrum
from 240 nm to 1000 nm. In addition, the Sinteron 2000 provides a 19-inch rack
unit that contains the power supply, controller and four pulse forming networks
(PFN). By allowing easy connections for these PFN stages, different pulse
durations can be quickly configured.
Imagine being able to illegally download a physical product the same way you can with music and video. The advent of desktop, home, and prosumer 3D printers is having huge repercussions in the intellectual property domain.
Ford will be the first automaker to commercially use Alcoa's tough & fast Micromill aluminum alloy process and materials, debuting on several 2016 F-150 truck components. Alcoa will also license its Micromill process and materials technology to Danieli Group.
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