introduced a new double stacked socket addressing high performance requirements
for testing processor and memory simultaneously - CBT-BGA-7002. The
contactor is a stamped spring pin with 26g actuation force per ball and cycle
life of 500,000 insertions. The self inductance of the contactor is 0.88nH,
insertion loss less than 1dB at 15.7GHz and capacitance 0.097pF. The current
capacity of each contactor is 4A at 80C temperature rise. Socket temperature
range is -55 to +180C. Socket also features a floating guide for precise ball
to pin alignment. The specific configuration of the package to be tested in the
CBT-BGA-7002 is a processor BGA, 15x15mm, 0.65mm pitch, 384 position, 22x22
ball array in the bottom socket and a memory BGA, 15x15mm, 0.65mm pitch, 112
position, 22x22 ball array in the top socket. The socket is mounted using
supplied hardware on the target PCB with no soldering, and uses the smallest
footprint in the industry. The smallest footprint allows inductors, resistors
and decoupling capacitors to be placed very close to the device for impedance
tuning. To use, place known good memory IC into the floating nest assembly and
mount to the socket lid using the supplied hardware. Place the BGA processor
into the socket base and lock the socket lid assembly on to the base using the
Pricing for the CBT-BGA-7002 is $1678 at qty 1 with reduced pricing available
depending on quantity required.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
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