Atmel Corp. has collaborated with H&D Wireless to deliver an IEEE802.1 1b+g Wi-Fi solution for Atmel's 32-bit AVR microcontrollers. In the collaboration, H&D Wireless will provide the SPB104 Wi-Fi extension board which will connect to the AVR32 UC3 evaluation kits through the SD card socket. The result is an efficient solution designed to have an overall power consumption five times lower than conventional solutions. H&D Wireless modules were designed to offer Wi-Fi capability for the 802.1 1 b+g spectrums with a throughput of 1 to 54 Mbps. The device offers a 150 µW sleep power consumption, 2.4 years of battery life, 220 mW RX power and an interface compatible to SDIO and SPI. In addition, the RF power output is 7-8 dB higher than the average on the market of +17.5 dBm.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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