The new PCI ExpressÂ® (PCIe) high-speed data acquisition card
with on-board field programmable gate array (FPGA) for real-time data
processing, provides higher sampling rates, faster measurement throughput and
even more flexibility to OEMs and many test and measurement engineers, while
maintaining precision and cost effectiveness. The Agilent U1084A Acqiris
high-speed data converter leverages the performance of Agilent's leading-edge
technology and know-how to meet the most demanding requirements. The product's
PCIe form factor and flexible architecture are ideal for use in medical
imaging, scientific instrumentation, non-destructive testing (NDT) and even the
validation of mixed-signal semiconductors in automated test equipment. The
extreme performance of the digitizer is also suited to advanced research in to
high-energy physics, nuclear physics and astrophysics. The product represents
the first implementation of Agilent Acqiris know-how and technology in to the
PCIe form factor. Designed for easy
implementation into desktop PC's and other PCIe systems, the card provides
incredible performance for integration as the key high-speed acquisition
component in any design. On-board FPGA
processing maximizes measurement throughput, by providing real-time data
reduction. Off-the-shelf firmware
includes signal averaging and peak analysis running at the full 4 GS/s
acquisition rates of the card. Combined
with up to 520 MB/s bus transfer with 4x PCIe measurement data can quickly be
passed to a host processor for application specific processing. The product
includes much Agilent IP designed specifically for high-speed data
acquisition. Most notably the on-board
FPGA is capable of finding, in real-time, the position of a trigger with a time
resolution of 10ps. This provides
increased timing resolution over alternative solutions in a PCIe digitizing
card that can be simply integrated as an off-the-shelf component.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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