National's ADC16DV160 is the industry's first
dual-channel 16-bit, 160 mega-samples per second (MSPS) pipeline
analog-to-digital converter (ADC). With two high-speed channels, the ADC16DV160
offers basestation radio receive path designers the world's best dynamic performance
and smallest footprint (10 mm by 10 mm) to reduce system size, design
complexity and development costs. The ADC16DV160 is targeted at multi-carrier,
multi-standard GSM/EDGE, WCDMA, LTE and WiMAX wireless basestations. The
ADC16DV160 operates on dual power supplies, 1.8 and 3.0V, with power-down and
fast recovery, and features industry-standard dual
LVDS outputs for interfacing to FPGAs and ASICs. It is supplied in a 68-pin,
10 x 10 mm LLP package. The ADC16DV160 addresses
the need for lower power, smaller footprint receive path analog components and greatly
improved linearity in the overall radio receive path. The ADC16DV160 consumes less than half the power
per ADC channel (650 mW) compared to competing ADCs, while offering the largest
input-bandwidth (1.4 GHz) and the industry's best dynamic performance at high
input frequencies. The ADC16DV160 delivers 91.2 dBFS SFDR, 76.3 dBFS SNR and 97.3 dBFS higher-order harmonic distortion at 197 MHz input frequency. Its
industry-leading dynamic performance enables increased basestation capacity and
coverage, allowing service providers to reach more customers and deliver a
higher quality of service. The innovation of the
ADC16DV160 is the very low-power core that allows two high-performance ADC
channels to be integrated in a single package - this is the industry's first
and only dual-channel 16-bit 160-MSPS pipeline ADC.
The per-channel power dissipation of the ADC16DV160 is less than half that of
the closest competitive 160-MSPS product. With this low-power breakthrough,
basestation vendors can now simultaneously satisfy their needs for low power
operation and multi-channel, multi-standard capability in the industry's
smallest footprint. The innovative architecture of the ADC16DV160 forces no
tradeoffs in basestation requirements, a value to vendors offered by no other
device in the industry.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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