W. L. Gore
& Assoc. Inc.'s very low-profile QSFP direct attach copper cable assembly
is "fiber-like" in size for QDR InfiniBand and 40 GbE aggregate applications. GORETM
Low-Profile Copper Cable fulfills the needs of dense, higher-port-count
switch installations while providing an even more reliable interconnect for
high-performance computing (HPC). This cable was provided to major switch
vendors and computing OEMs for testing over the last six to eight months and
was tested for compliance and interoperability in spring 2009. The reduced bend radius and smaller diameter of GORETM
Low-Profile Cable allow for more aggressive routing as well as cleaner dressing
of the cables in high-performance computing (HPC) environments. This new cable
is also less prone to interfere with the closing of cabinet doors in dense
environments. The data centers and OEMs continue to reinforce that the
reduction in cable mass provides greater air flow for more efficient cooling,
which results in increased electronic efficiencies and reduced failures; this
is a benefit that is sometimes overlooked. GORETM Low-Profile Copper
Cable was developed for GORETM QSFP Assemblies and InfiniBand QDR applications.
With a diameter of 0.170 inch for a 4x channel, eight-pair cable, the
cross-section savings is 37 percent compared to alternative Gore cables and 58
percent compared to typical industry offerings. This low-profile cable is
targeted at high-performance computing applications, where a large percentage
of high-density port-count interconnects are 2m or less (e.g., in
top-of-the-rack switching installations).
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