Conexant's CX2070X products integrate an
audio/voice DSP, multi-bit codec, digital and analog input/out interfaces, and
Class-D/PWM driver in a cost-effective single-chip package. The SoCs are
available in multiple configurations. An embedded software configuration
toolbox allows developers to customize audio systems and optimize listening
experiences. The devices feature a powerful suite of Conexant-developed
technical innovations that dramatically improve audio/voice quality and enhance
user experience including 3-D effects that use psychoacoustic algorithms to
widen the sound output to its original stereo recording and create an immersive
surround effect. The
turnkey solutions enable a whole new class of
integrated audio and voice products. The CX2070X integrates an audio/voice DSP, codec, and Class-D/PWM
driver into one chip. The SoCs enable engineers to design a wide range of audio
and voice products, and feature multiple 24-bit DACs/ADCs, small profile, and excellent audio/voice processing algorithms: Subband AEC
eliminates speaker-to-microphone feedback; noise reduction eliminates ambient
near- and far-end noises; Subband LEC eliminates echo from twisted-pair
crossover (a common problem in hybrid and intercom reference design).; 3D
Expander widens the sound output from narrowly separated speakers; repositions
the sound for an immersive surround effect and BrightSoundTM dramatically improves audio quality and reduces speaker clipping. The CX2070X is the next
generation of Conexant's Speakers-on-a-Chip (SPoC) products.The turnkey
solution lowers manufacturing costs by eliminating a multiple-chip design, and
makes it easy and economical for manufacturers to design products for audio and
voice applications faster. The CX2070X has unsurpassed audio and voice
processing algorithms that enable customization and superior quality.
For more information:†† http://www.conexant.com/products/entry.jsp?id=573 or http://www.conexant.com/products/entry.jsp?id=557
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