MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
Parallax Inc. is known for developing the Basic Stamp microcontroller development board and educational accessory kits. In addition to developing a user-friendly educational platform to learn about 8-bit microcontrollers and software programming, it created a multicore 32-bit chip called the Propeller.
Researchers working with additive manufacturing have said multimaterial techniques will allow industry “to fabricate materials with combinations of density, strength, and thermal expansion that do not exist [yet].”
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