MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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