MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
In a move that strengthens its 3D design business, Stratasys continued a 15-month buying spree this week by announcing its plan to acquire GrabCAD, a provider of a cloud-based collaboration environment for engineers.
Many diverse markets take advantage of semiconductor IP; so many that no one can recite the entire list without leaving off several. So why do we track all the vertical markets? They all have a unique set of requirements and value attributes differently. One major vertical market segment is automotive.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.