MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
Days after a massive, distributed denial-of-service attack took down dozens of major websites around the country, ARM Holdings plc is rolling out a pair of new processor architectures aimed at shoring up IoT security.
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