MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
A Tokyo company, Miraisens Inc., has unveiled a device that allows users to move virtual 3D objects around and "feel" them via a vibration sensor. The device has many applications within the gaming, medical, and 3D-printing industries.
In the last few years, use of CFD in building design has increased manifolds. Computational
fluid dynamics is effective in analyzing the flow and thermal properties of air within spaces. It can be used in buildings to find the best measures for comfortable temperature at low energy use.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.