MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
Producing high-quality end-production metal parts with additive manufacturing for applications like aerospace and medical requires very tightly controlled processes and materials. New standards and guidelines for machines and processes, materials, and printed parts are underway from bodies such as ASTM International.
Engineers at the University of San Diego’s Jacobs School of Engineering have designed biobatteries on commercial tattoo paper, with an anode and cathode screen-printed on and modified to harvest energy from lactate in a person’s sweat.
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