MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
Samsung's Galaxy line of smartphones used to fare quite well in the repairability department, but last year's flagship S5 model took a tumble, scoring a meh-inducing 5/10. Will the newly redesigned S6 lead us back into star-studded territory, or will we sink further into the depths of a repairability black hole?
In 2003, the world contained just over 500 million Internet-connected devices. By 2010, this figure had risen to 12.5 billion connected objects, almost six devices per individual with access to the Internet. Now, as we move into 2015, the number of connected 'things' is expected to reach 25 billion, ultimately edging toward 50 billion by the end of the decade.
NASA engineer Brian Trease studied abroad in Japan as a high school student and used to fold fast-food wrappers into cranes using origami techniques he learned in library books. Inspired by this, he began to imagine that origami could be applied to building spacecraft components, particularly solar panels that could one day send solar power from space to be used on earth.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.