MoldMAX V is a new copper-nickel-silicon-chrome alloy that has a hardness of 30 HRC and thermal conductivity approximately four to five times greater than P20 tool steel. The new grade is the second in a series of non-beryllium-copper alloys introduced by Brush Wellman. Moldmax XL is a copper-nickel-tin alloy with similar properties. Benefits of the new series include reduced cycle times through improved heat removal, as well as better dimensional stability of the molded part. Another advantage is availability of the material in large block sizes. The photos show forged rings made of an earlier (beryllium-containing) grade of MoldMAX. For more information, go to http://rbi.ims.ca/4921-512.
Practically all electronic devices today contain metals that may
be coming from conflict-ravaged African countries. And political pressures will increasingly influence how these minerals are sourced and used in products.
Weaned on the relatively effortless connectivity of today’s massive variety of consumer electronic products, automation users in the IIoT will likely not tolerate too many competing, piecemeal standards for long. And the Industrial Internet Consortium is trying to preempt history.
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