JECED and the International Electronics Manufacturing Initiative have produced two documents intended to help manufacturers reduce the risk of tin whiskers growing on lead-free products. JESD201 and JP2002 (developed with IPC) set out strategies to help reduce the occurrence of tin whiskers. Researchers conceded that these are mitigation strategies and that "it is not possible to guarantee that tin whiskers will not grow under field conditions."
This is tough news for manufacturers in the industries such as defense, aerospace and medical equipment, which are exempt from the RoHS lead-free laws. The exempt industries are now forced to choose between risking tin whiskers — and potential product failure — or redesigning their products with pricey high-reliability components.
Researchers at Lawrence Livermore National Laboratory have published two physics-based models for the selective laser melting (SLM) metals additive manufacturing process, so engineers can understand how it works at the powder and scales, and develop better parts with less trial and error.
The Internet happened.” Those three words spoken yesterday by Marc Ostertag, North America president of B&R Automation at Pacific Design & Manufacturing, now taking place in Anaheim through Feb. 11, continues to bring ever-lasting changes to our ways of life and will undoubtedly transform manufacturing.
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