The fifth edition of the Interconnection & Packaging Solutions shortform catalog includes a complete section on ball grid array (BGA) products, including the Ballnest(TM) and BallLock(TM) sockets, and the SnapAdapt(TM) adapter line. High-frequency RF sockets and land grid array (LGA) socket designs are also featured. Other products include standard and low-profile DIP/SIP sockets and headers; display sockets; and other standard and non-standard socket configurations.
In an age of globalization and rapid changes through scientific progress, two of our societies' (and economies') main concerns are to satisfy the needs and wishes of the individual and to save precious resources. Cloud computing caters to both of these.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.