The fifth edition of the Interconnection & Packaging Solutions shortform catalog includes a complete section on ball grid array (BGA) products, including the Ballnest(TM) and BallLock(TM) sockets, and the SnapAdapt(TM) adapter line. High-frequency RF sockets and land grid array (LGA) socket designs are also featured. Other products include standard and low-profile DIP/SIP sockets and headers; display sockets; and other standard and non-standard socket configurations.
The 3D printing revolution seems to have a knack for quickly moving technology ahead by way of collaborative effort and even a little friendly competition -- all of course in the name of scientific advancement.
Advantech has launched a new series of motion-control I/O modules to meet the increased demands that come with more distributed industrial systems that require control of a growing number of axes and devices.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is