The fifth edition of the Interconnection & Packaging Solutions shortform catalog includes a complete section on ball grid array (BGA) products, including the Ballnest(TM) and BallLock(TM) sockets, and the SnapAdapt(TM) adapter line. High-frequency RF sockets and land grid array (LGA) socket designs are also featured. Other products include standard and low-profile DIP/SIP sockets and headers; display sockets; and other standard and non-standard socket configurations.
Sales of semiconductors, interconnects, and other electronic components in North America were flat through the second quarter of 2015, reflecting a pattern that’s been repeating itself for several years.
An in-depth survey of 700 current and future users of 3D printing holds few surprises, but results emphasize some major trends already in progress. Two standouts are the big growth in end-use parts and metal additive manufacturing (AM) most respondents expect.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.