The fifth edition of the Interconnection & Packaging Solutions shortform catalog includes a complete section on ball grid array (BGA) products, including the Ballnest(TM) and BallLock(TM) sockets, and the SnapAdapt(TM) adapter line. High-frequency RF sockets and land grid array (LGA) socket designs are also featured. Other products include standard and low-profile DIP/SIP sockets and headers; display sockets; and other standard and non-standard socket configurations.
Some cars are more reliable than others, but even the vehicles at the bottom of this year’s Consumer Reports reliability survey are vastly better than those of 20 years ago in the key areas of powertrain and hardware, experts said this week.
Many of the materials in this slideshow are resins or elastomers, plus reinforced materials, styrenics, and PLA masterbatches. Applications range from automotive and aerospace to industrial, consumer electronics and wearables, consumer goods, medical and healthcare, as well as sporting goods, and materials for protecting food and beverages.
While many larger companies are still reluctant to rely on wireless networks to transmit important information in industrial settings, there is an increasing acceptance rate of the newer, more robust wireless options that are now available.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.