Overall product costs and part weight were reduced by conversion of this housing used in a microwave telecom application. Elimination of machined chips of an expensive nickel alloy was one part of the cost reduction. Another was a design that incorporated threaded posts that had been separate "stand-offs" with longer bolts. All eight threaded holes were molded into the part. Like other microelectronic devices used in telecommunications, this part needed to be sealed in a hermetic package. The molder, FloMet of DeLand, FL, went to sister company Teka Seal for a glass-to-metal sealing process that completes the part. Final nickel/gold plating was done through an outside contractor. Cost savings over the original wrought design were 60 percent. For more information on FloMet, go to http://rbi.ims.ca/4933-516.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.