Overall product costs and part weight were reduced by conversion of this housing used in a microwave telecom application. Elimination of machined chips of an expensive nickel alloy was one part of the cost reduction. Another was a design that incorporated threaded posts that had been separate "stand-offs" with longer bolts. All eight threaded holes were molded into the part. Like other microelectronic devices used in telecommunications, this part needed to be sealed in a hermetic package. The molder, FloMet of DeLand, FL, went to sister company Teka Seal for a glass-to-metal sealing process that completes the part. Final nickel/gold plating was done through an outside contractor. Cost savings over the original wrought design were 60 percent. For more information on FloMet, go to http://rbi.ims.ca/4933-516.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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