The semiconductor industry is bringing new technologies to fruition ahead of schedule, according to the Semiconductor Industry Association technology roadmaps. The latest roadmap, which includes input from the international community, shows that the technology to make chips with 130-nanometer line widths should be available in 2002--a year earlier than the 1997 forecast predicted and two years earlier than was thought in 1994. In addition, 250-nm technology debuted in 1997--a year early--and 180-nm technology should come into its own next year. (Source: Semiconductor Industry Association)
Two new technologies from Stratasys, created in partnership with Boeing, Ford, and Siemens, will bring accurate, repeatable manufacturing of very large thermoplastic end products, and much bigger composite parts, onto the factory floor for industries including automotive and aerospace.
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