(http://rbi.ims.ca/4917-549). Instead of a single sensor, this thermal, infrared imaging camera employs an array of sensors called a Thermophile Focal Array (TPFA). The technique enables high resolution in a power-efficient, smaller and lighter camera for portable applications. After the sensors convert the energy to electrical signals, Analog Devices' Blackfin ADSP-BF533 processor interprets the signals and assigns color scales for a visual indication of temperature. The choice of the ADSP-BF533 processor was based on the unit's industry-standard interfaces with a high-performance (greater than 600 MHz) signal-processing core. For more information on Analog Devices' Blackfin ADSP-BF533 processor, go to http://rbi.ims.ca/4917-550.
Our LinkedIn systems and product design engineering group discusses if they are happy with their decision of remaining a technical contributor instead of becoming a manager.
Against a backdrop of mounting product complexity and a need to keep a lid on development costs, companies are recognizing a need to make simulation a more integral part of the design process. In response, vendors in the CAD world are building out CAE functionality as part of their CAD suites while simulation vendors are building tighter integrations to leading CAD tools. Keith Meintjes, Ph.D., Practice Manager, Simulation and Analysis at CIMdata, Inc., joins Design News CAD Editor Beth Stackpole in this radio program to explore the new face of integrated CAD and CAE, how companies are benefitting from this tighter partnership between platforms, and how integrating CAE earlier in the development cycle pays off in optimized product designs.
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