The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
The amount of plastic clogging the ocean continues to grow. Some startling, not-so-good news has come out recently about the roles plastic is playing in the ocean, as well as more heartening news about efforts to collect and reuse it.
Some of our culture's most enduring robots appeared in the 80s. The Aliens series produced another evil android, and we saw light robot fare in the form of Short Circuit. Two of the great robots of all time also showed up: The Terminator and RoboCop.
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