The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
In his keynote address at the RAPID 2015 conference last week, Made In Space CTO Jason Dunn gave an update on how far his company and co-development partner NASA have come in their quest to bring 3D printing to the space station -- and beyond.
On Memorial Day, Americans remember the sacrifices the US armed forces have made, and continue to make, in service to the country. All of us should also consider the developments in technological capabilities and equipment over the years that contribute to the success of our military operations.
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