The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
The word “smart” is becoming the dumbest word around. It has been applied to almost every device and system in our homes. In addition to smartphones and smart meters, we now hear about smart clothing and smart shoes, smart lights, smart homes, smart buildings, and every trendy city today has its smart city project. Just because it has a computer inside and is connected to the Web, does not mean it is smart.
Are you being paid enough? Do you want a better job? According to a recent survey Manpower released just before Engineers Week, employers and engineers don't see eye-to-eye about the state of US engineers' skills and experience.
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