The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
A make-your-own Star Wars Sith Lightsaber hilt is heftier and better-looking than most others out there, according to its maker, Sean Charlesworth. You can 3D print it from free source files, and there's even a hardware kit available -- not free -- so you can build one just in time for Halloween.
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