The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
BMW has already incorporated more than 10,000 3D-printed parts in the Rolls-Royce Phantom and intends to expand the use of 3D printing in its cars even more in the future. Meanwhile, Daimler has started using additive manufacturing for producing spare parts in Mercedes-Benz Trucks.
Researchers have been developing a number of nano- and micro-scale technologies that can be used for implantable medical technology for the treatment of disease, diagnostics, prevention, and other health-related applications.
SABIC's lightweighting polycarbonate glazing materials have appeared for the first time in a production car: the rear quarter window of Toyota's special edition 86 GRMN sports car, where they're saving 50% of its weight compared to conventional glass.
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