The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
Most cyber attacks could be avoided by adopting a list of Critical Security Controls that were created by the Center for Internet Security. That’s the message from Steve Mustard of the Automation Federation.
How 3D printing fits into the digital thread, and the relationship between its uses for prototyping and for manufacturing, was the subject of a talk by Proto Labs' Rich Baker at last week's Design & Manufacturing Minneapolis.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
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