The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChipís WLCSP products.
Festo's BionicKangaroo combines pneumatic and electrical drive technology, plus very precise controls and condition monitoring. Like a real kangaroo, the BionicKangaroo robot harvests the kinetic energy of each takeoff and immediately uses it to power the next jump.
Design News and Digi-Key presents: Creating & Testing Your First RTOS Application Using MQX, a crash course that will look at defining a project, selecting a target processor, blocking code, defining tasks, completing code, and debugging.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.