The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
Imagine being able to illegally download a physical product the same way you can with music and videos. That’s basically what’s happening with 3D printing and digital manufacturing, with huge repercussions in the intellectual property domain.
Ford will be the first automaker to commercially use Alcoa's tough & fast Micromill aluminum alloy process and materials, debuting on several 2016 F-150 truck components. Alcoa will also license its Micromill process and materials technology to Danieli Group.
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