The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
A bold, gold, open-air coupe may not be the ticket to automotive nirvana for every consumer, but Lexus’ LF-C2 concept car certainly turned heads at the recent Los Angeles Auto Show. What’s more, it may provide a glimpse of the luxury automaker’s future.
The complexity of diesel engines means optimizing their performance requires a large amount of experimentation. Computational fluid dynamics (CFD) is a very useful and intuitive tool in this, and cold flow analysis using CFD is an ideal approach to study the flow characteristics without going into the details of chemical reactions occurring during the combustion.
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