The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
Artificially created metamaterials are already appearing in niche applications like electronics, communications, and defense, says a new report from Lux Research. How quickly they become mainstream depends on cost-effective manufacturing methods, which will include additive manufacturing.
Sharon Glotzer and David Pine are hoping to create the first liquid hard drive with liquid nanoparticles that can store 1TB per teaspoon. They aren't the first to find potential data stores, as Harvard researchers have stored 700 TB inside a gram of DNA.
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