The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
Conventional wisdom holds that MIT, Cal Tech, and Stanford are three of the country’s best undergraduate engineering schools. Unfortunately, when conventional wisdom visits the topic of best engineering schools, it too often leaves out some of the most distinguished programs that don’t happen to offer PhD-level degrees.
Airbus Defence and Space has 3D printed titanium brackets for communications satellites. The redesigned, one-piece 3D-printed brackets have better thermal resistance than conventionally manufactured parts, can be produced faster, cost 20% less, and save about 1 kg of weight per satellite.
A group of researchers at the Seoul National University have discovered a way to take material from cigarette butts and turn it into a carbon-based material that’s ideal for storing energy and creating a powerful supercapacitor.
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