The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
What should be the perception of a product’s real-world performance with regard to the published spec sheet? While it is easy to assume that the product will operate according to spec, what variables should be considered, and is that a designer obligation or a customer responsibility? Or both?
Biomimicry has already found its way into the development of robots and new materials, with researchers studying animals and nature to come up with new innovations. Now thanks to researchers in Boston, biomimicry could even inform the future of electrical networks for next-generation displays.
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