The problem of putting lead-free components into wireless devices may be at least partly solved. Previously, lead-free packaging had been prone to drop test failure. Phoenix-based FlipChip International says it has demonstrated significantly enhanced reliability in its drop test specification for its Wafer-Level Chip Scale Packaging (WLCSP) while using Enhanced Lead-Free (ELF) technology. The company notes the drop test robustness is a critical reliability requirement for WLCSP applications targeting advanced wireless handheld product applications where the device is at risk during the normal lifetime due to mechanical shock and vibration. FlipChip notes its ELF technology combines advanced lead-free metallurgy and polymer technologies to achieve these reliability improvements. The company says the ELF technology can be extended across all of FlipChip’s WLCSP products.
Samsung's Galaxy line of smartphones used to fare quite well in the repairability department, but last year's flagship S5 model took a tumble, scoring a meh-inducing 5/10. Will the newly redesigned S6 lead us back into star-studded territory, or will we sink further into the depths of a repairability black hole?
In 2003, the world contained just over 500 million Internet-connected devices. By 2010, this figure had risen to 12.5 billion connected objects, almost six devices per individual with access to the Internet. Now, as we move into 2015, the number of connected 'things' is expected to reach 25 billion, ultimately edging toward 50 billion by the end of the decade.
NASA engineer Brian Trease studied abroad in Japan as a high school student and used to fold fast-food wrappers into cranes using origami techniques he learned in library books. Inspired by this, he began to imagine that origami could be applied to building spacecraft components, particularly solar panels that could one day send solar power from space to be used on earth.
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