SURFACE SCANNING DISPLACEMENT SENSOR
Keyence's ball grid array (BGA) checker, the LT-9000 uses laser displacement sensing technology to provide accurate surface scanning for semiconductor ball grid array (BGA) packages. The checker provides measurement resolution as high as 0.01 µm (0.0004 mil) with target images magnified by up to 85 times on the monitor, even on round shapes. With a reference distance of 0.20 inch (6 mm), the measuring range is 0.01 inch ±0.3 mm. The unit has a linearity of ±0.5 percent of full scale. The LT-9000 Series provides critical measurements for other semiconductor processes including checking the etching progress on the wafer by measuring the dicing groove depth. The unit can also measure the marking depth for dates, lot numbers, and other lased etched items to ensure good print quality. For more information on Keyence LT-9000, go to http://rbi.ims.ca/4416-715.
COMBINATION TEMPERATURE SENSOR
Minco's air handling system sensor includes both a low temperature cut-out sensor (freeze stat) and an averaging resistance temperature sensor. Designed specifically for HVAC and building automation markets, the Chill-Out Combination Sensor is a solid-state design with the relay integral to the tubing. The unit senses freezing temperatures within any six-inch section along its length and provides an averaging function as well. Replacing gas capillary tubes and mechanical switches, the sensor installs either vertically or horizontally. The combination sensor eliminates the need for a separate relay outside the airflow system reducing installation time and effort. Standard models have a 41F set point with a single pole double throw (SPDT) relay and units can be ordered with custom trip points. For more information on Minco's Chill-Out Combination Sensor, go to http://rbi.ims.ca/4416-716.
PROGRAMMABLE SIGNAL CONDITIONER
Texas Instruments designed its PGA309 specifically for bridge sensors. The programmable analog signal conditioner provides digital calibration for zero, span, zero drift, and span drift, and amplifies the sensor signal and sensor linearization errors with applied stress (pressure, strain, etc.). Using a one-wire digital serial interface or a two-wire industry-standard connection to perform the calibration, the calibration parameters are stored in external nonvolatile memory eliminating a manual trim operation. A 2×2 input multiplexer (mux), auto-zero programmable-gain instrumentation amplifier, linearization circuit, voltage reference, internal oscillator, control logic, and an output amplifier are all part of the all-analog signal path. The precision, low-drift, no 1/f noise Front-End Programmable gain amplifier and output amplifier combination provide an overall gain that can be adjusted from 2.7 to 1152 V/V. For more information on Texas Instruments' PGA309, go tohttp://rbi.ims.ca/4416-717.