IBM (www.ibm.com) executives have gone through many pens in recent weeks. Joint agreements with Chartered Semiconductor (www.charteredsemi.com) and Infineon Technologies (www.infineon.com) will let the three companies work together to make parts with 65-nm size features. Development will be done in the IBM facility in East Fishkill, NY. Under a separate pact with Raytheon (www.raytheon.com), the two will jointly develop custom ICs for the defense and aerospace markets under a deal that could be worth $100 million to IBM over five years.
Design collaboration now includes the entire value chain. From suppliers to customers, purchasing to outside experts, the collaborative design team includes internal and external groups. The design process now stretches across the globe in multiple software formats.
A new high-pressure injection-molding technology produces near-net shape parts with 2-inch-thick walls from high-performance materials like PEEK, PAI, and carbon-filled polymers. Parts show no voids, sinks, or porosity, have more consistent mechanical properties, and are stronger.
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