IBM (www.ibm.com) executives have gone through many pens in recent weeks. Joint agreements with Chartered Semiconductor (www.charteredsemi.com) and Infineon Technologies (www.infineon.com) will let the three companies work together to make parts with 65-nm size features. Development will be done in the IBM facility in East Fishkill, NY. Under a separate pact with Raytheon (www.raytheon.com), the two will jointly develop custom ICs for the defense and aerospace markets under a deal that could be worth $100 million to IBM over five years.
Altair has released an update of its HyperWorks computer-aided engineering simulation suite that includes new features focusing on four key areas of product design: performance optimization, lightweight design, lead-time reduction, and new technologies.
At IMTS last week, Stratasys introduced two new multi-materials PolyJet 3D printers, plus a new UV-resistant material for its FDM production 3D printers. They can be used in making jigs and fixtures, as well as prototypes and small runs of production parts.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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