IBM (www.ibm.com) executives have gone through many pens in recent weeks. Joint agreements with Chartered Semiconductor (www.charteredsemi.com) and Infineon Technologies (www.infineon.com) will let the three companies work together to make parts with 65-nm size features. Development will be done in the IBM facility in East Fishkill, NY. Under a separate pact with Raytheon (www.raytheon.com), the two will jointly develop custom ICs for the defense and aerospace markets under a deal that could be worth $100 million to IBM over five years.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
Design engineers need to prepare for a future in which their electronic products will use not just one or two, but possibly many user interfaces that involve touch, vision, gestures, and even eye movements.
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